July 12, 2004

FEI Introduces DA 300HP Next-Generation DualBeam(TM) for Automated Root Cause Defect Analysis in the Fab

HILLSBORO, Ore., July 12 /PRNewswire-FirstCall/ -- FEI Company (Nasdaq: FEIC) released its new DA 300HP, the next-generation DualBeam™ system for automated in-fab defect analysis extendable to the 45nm design node. The system is capable of delivering better control over advanced processes giving semiconductor manufacturers the power to improve yields, reduce time-to- market, and drastically reduce process development costs. The DA 300HP system is currently installed at key Beta development sites in Europe and Asia and is in full production at others.

The Defect Analyzer 300HP accommodates 300 mm and 200 mm wafers and delivers a powerful combination of tool automation, industry-leading cross sectional electron imaging, unsurpassed focused ion beam milling speed and accuracy, and proprietary beam chemistry technologies to enable 3D analysis of advanced process defects. By providing critical root cause analysis in a fraction of the time required by other techniques, the Defect Analyzer 300HP ensures that production processes can be optimized in real-time.

"The new DA 300HP builds on the success of the DA 300 introduced to semiconductor fabs two years ago," commented Janet Teshima, FEI VP and director of structural diagnostics products. "The ability of the Defect Analyzer line to provide rapid sub-surface diagnostic capabilities for advanced devices with shrinking geometries and dual damascene processes has enabled the Defect Analyzer to win every time when in head to head competition with other root cause analysis tools and techniques. We believe the DA 300HP will enable us to keep our competitive lead in fab-based defect analysis."

The DA 300HP's software uses programmed recipes for consistent automation of repetitive tasks; Automated Defect Redetection (ADR) and Automated Defect Cross-Sectioning (ADX) ensure maximum tool use with minimal operator intervention, allowing users to focus on identifying what parameters need to change to improve process yield. The advanced Defect Analyzer system is engineered to operate in the most demanding fab environments. Cleanroom-compatible system construction, S2 safety certification, and optional factory automation capabilities make the system an easy tool to integrate into fab facilites.

The DA 300HP is also a part of FEI's new UltraView™ tool suite that rapidly extracts samples from in-process wafers and transports the samples to the lab for ultra-high resolution STEM and atomic-level TEM analysis. Both the DA 300HP and UltraView will be featured at SEMICON West 2004 in Booth 1316 at the Moscone Center in San Francisco, July 12-14. More information on these products can be found on FEI 's new website at: http://www.feicompany.com .

About FEI

FEI's Tools for Nanotech™, featuring focused ion- and electron-beam technologies, deliver 3D characterization, analysis and modification capabilities with resolution down to the sub-Angstrom level. With R&D centers in North America and Europe, and sales and service operations in more the 40 countries around the world, FEI is bringing the nanoscale within the grasp of leading researchers and manufacturers and helping to turn some of the biggest ideas of the this century into reality.

SOURCE  FEI Company
    -0-                             07/12/2004
    /CONTACT:  Dan Zenka, APR, Corporate Communications of FEI Company,
+1-503-726-2695, or dzenka@feico.com/
    /Web site:  http://www.feicompany.com /
    (FEIC)


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