HILLSBORO, Ore., Dec. 19 /PRNewswire/ -- FEI Company (Nasdaq: FEIC) opened trading on the Nasdaq Stock Market today, culminating a successful year of record revenues, strong earnings growth and expanding markets based on the semiconductor industry's adoption of FEI's patented, industry-leading DualBeam™ and single column focused ion and electron beam products. Both products are playing integral roles in new chip designs and processes.
"Clearly, being selected to open the Nasdaq today is a great honor and a significant milestone for FEI," said Vahe Sarkissian, president and chief executive officer. "Despite the severest downturn ever in our industry, we are finishing a record year. I attribute our success to the support of our customers, investors, employees and to the leadership of our officers and board of directors."
During the year, FEI completed a $280 million secondary public offering, a $175 million private placement of 5.5% convertible subordinated notes, and announced a stock repurchase plan to enhance shareholder value. Sales through the first nine months of 2001 increased 24.0 percent over a year ago to $279.4 million. Including non-cash charges, nine-month net income totaled $24.4 million, or $0.77 per diluted share, versus $11.6 million, or $0.40 per diluted share, in the corresponding nine-month period of fiscal 2000.
The company has said it expects to generate revenues in the high $80 million range and cash earnings per share in the mid-20 cent range in the fourth quarter of 2001.
About FEI Company:
FEI is the 3D innovator and leading supplier of Structural Process Management™ solutions to the world's technology leaders in the fields of semiconductors, data storage, structural biology and industry. Its range of industry-leading DualBeam™ and single column focused ion and electron beam products enables manufacturers and researchers to keep pace with technology shifts and develop next generation technologies and products. FEI's products allow advanced three-dimensional metrology, device editing, trimming, and structural analysis for management of sub-micron structures including those found in integrated circuits, high-density magnetic storage devices, industrial materials, chemical compounds, and biological structures. FEI solutions deliver enhanced production yields, lower costs and faster time to market-critical benefits in highly competitive markets. Headquartered in Hillsboro, Oregon, FEI has more than 1,500 employees worldwide, with additional development and manufacturing operations located in Peabody, Massachusetts; Eindhoven, The Netherlands; and Brno, Czech Republic.
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Web site: http: //www.feic.com
CONTACT: Dan Zenka, Corporate Communications Manager of FEI Company, +1-503-844-2695, or email@example.com; or Ron Parham of PondelWilkinson MS&L, +1-503-297-0472, or firstname.lastname@example.org, for FEI Company